The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2017

Filed:

Oct. 08, 2015
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Yuki Wakabayashi, Nagaokakyo, JP;

Shigeru Tago, Nagaokakyo, JP;

Daisuke Tsuruga, Nagaokakyo, JP;

Masaki Kawata, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H03H 7/01 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/32 (2006.01); H03H 1/00 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H03H 7/0115 (2013.01); H05K 1/028 (2013.01); H05K 1/0298 (2013.01); H05K 1/186 (2013.01); H05K 3/0064 (2013.01); H05K 3/0094 (2013.01); H05K 3/32 (2013.01); H05K 3/4617 (2013.01); H05K 3/4697 (2013.01); H03H 2001/0085 (2013.01); H05K 1/165 (2013.01); H05K 3/3484 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/09263 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10636 (2013.01); H05K 2203/046 (2013.01); H05K 2203/063 (2013.01); H05K 2203/1484 (2013.01); Y02P 70/611 (2015.11);
Abstract

A component-embedded substrate includes a cavity including through-holes penetrating through resin sheets in a stacked body of resin sheets having flexibility. An electronic chip component including external electrodes is disposed in the cavity. The resin sheet on which the electronic chip component is located is provided with through-holes into which conductive pastes are filled. The resin sheet includes cut-away portions communicating with a through-hole and located at a distance from each other across the through-hole. When this stacked body is hot-pressed, the conductive pastes overflow from the through-holes. However, the overflowing conductive pastes enter the cut-away portions.


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