The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2017
Filed:
Mar. 24, 2015
Applicant:
Enthone Inc., West Haven, CT (US);
Inventors:
Yung-Herng Yau, Allentown, PA (US);
Thomas B. Richardson, Killingworth, CT (US);
Joseph A. Abys, Guilford, CT (US);
Karl F. Wengenroth, Stratford, CT (US);
Anthony Fiore, Wethersfield, CT (US);
Chen Xu, New Providence, NJ (US);
Chonglun Fan, Portland, OR (US);
John Fudala, Cheshire, CT (US);
Assignee:
Other;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); C23C 18/40 (2006.01); H01B 1/02 (2006.01); C23C 22/06 (2006.01); C23C 22/58 (2006.01); C23C 18/44 (2006.01); C23C 18/42 (2006.01); C25D 3/64 (2006.01); C25D 3/56 (2006.01); C25D 3/46 (2006.01); C23C 18/54 (2006.01); H05K 3/24 (2006.01); C09D 1/00 (2006.01); C23C 18/16 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); C09D 1/00 (2013.01); C23C 18/16 (2013.01); C23C 18/42 (2013.01); C23C 18/44 (2013.01); C23C 18/54 (2013.01); C23C 22/06 (2013.01); C23C 22/58 (2013.01); C25D 3/46 (2013.01); C25D 3/56 (2013.01); C25D 3/64 (2013.01); H05K 3/244 (2013.01); C23C 18/1614 (2013.01); C23C 18/1616 (2013.01); C23C 18/1633 (2013.01); C23C 18/1683 (2013.01); C23C 18/1687 (2013.01); H05K 3/422 (2013.01); H05K 2203/0257 (2013.01); H05K 2203/073 (2013.01); Y10S 205/916 (2013.01);
Abstract
Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.