The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2017
Filed:
Dec. 12, 2014
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Man Hue Choi, Seoul, KR;
Min Jae Kim, Seoul, KR;
Se Woong Na, Seoul, KR;
Hyun Gyu Park, Seoul, KR;
In Hee Cho, Seoul, KR;
Seung Kwon Hong, Seoul, KR;
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); G02F 1/1335 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0281 (2013.01); H05K 1/181 (2013.01); G02F 1/133615 (2013.01); G02F 2001/133612 (2013.01); H05K 1/0278 (2013.01); H05K 1/189 (2013.01); H05K 3/28 (2013.01); H05K 2201/046 (2013.01); H05K 2201/10106 (2013.01);
Abstract
Provided is a printed circuit board, including: a support substrate including a first region in which light emitting elements are mount, a second region extending from the first region, and a bending portion between the first region and the second region, an insulating substrate on the support substrate, wiring portions on the insulating substrate, and a protective layer on the wiring portions.