The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2017
Filed:
Mar. 30, 2012
Applicants:
Alexander Dohn, Memmelsdorf, DE;
Alfred Thimm, Wunsiedel, DE;
Inventors:
Alexander Dohn, Memmelsdorf, DE;
Alfred Thimm, Wunsiedel, DE;
Assignee:
CERAMTEC GmbH, Plochingen, DE;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); F21V 29/508 (2015.01); F21V 29/89 (2015.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H05K 3/00 (2006.01); F21V 29/80 (2015.01); F21V 29/85 (2015.01); H01L 33/64 (2010.01); H05K 1/03 (2006.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
H05K 1/0201 (2013.01); F21V 29/508 (2015.01); F21V 29/80 (2015.01); F21V 29/86 (2015.01); F21V 29/89 (2015.01); H01L 23/3677 (2013.01); H01L 23/3735 (2013.01); H05K 1/0203 (2013.01); H05K 3/0061 (2013.01); F21Y 2115/10 (2016.08); H01L 33/642 (2013.01); H01L 2924/0002 (2013.01); H05K 1/0306 (2013.01); H05K 2201/10106 (2013.01);
Abstract
The invention relates to a ceramic printed circuit board comprising an upper side and a lower side, sintered metallization regions being arranged on the upper side, and the lower side being embodied as a cooling body. In order to improve the heat dissipation of components on the upper side of the printed circuit board, the lower side is also provided with sintered metallization regions to which a metal cooling body is soldered.