The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2017

Filed:

Oct. 07, 2016
Applicant:

Osram Opto Semiconductor Gmbh, Regensburg, DE;

Inventors:

Karl Weidner, München, DE;

Ralph Wirth, Lappersdorf, DE;

Axel Kaltenbacher, Ingolstadt, DE;

Walter Wegleiter, Nittendorf, DE;

Bernd Barchmann, Regensburg, DE;

Oliver Wutz, Regensburg, DE;

Jan Marfeld, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/18 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 31/0232 (2014.01); H01L 33/60 (2010.01); H01L 31/0203 (2014.01); H01L 33/56 (2010.01); H01L 23/31 (2006.01); H01L 25/075 (2006.01); H01L 25/04 (2014.01); H01L 31/02 (2006.01); H01L 33/50 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 33/483 (2013.01); H01L 23/3107 (2013.01); H01L 23/3185 (2013.01); H01L 25/042 (2013.01); H01L 25/0753 (2013.01); H01L 31/0203 (2013.01); H01L 31/02005 (2013.01); H01L 31/0232 (2013.01); H01L 31/02327 (2013.01); H01L 33/486 (2013.01); H01L 33/502 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/54 (2013.01); H01L 2924/0002 (2013.01);
Abstract

An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having side areas covered by a shaped body; at least one via including an electrically conductive material; and at least one electrically conductive connection electrically conductively connected to the semiconductor chip and the via, wherein the via is laterally spaced part from the semiconductor chip; the via includes a contact pin, the contact pin including an electrically conductive material; and the contact pin is laterally completely enclosed by the shaped body.


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