The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2017

Filed:

May. 23, 2016
Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Hong-Wei Lee, San Jose, CA (US);

Jeffery Beck, Philomath, OR (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14643 (2013.01); H01L 27/1462 (2013.01); H01L 27/1469 (2013.01); H01L 27/14616 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14685 (2013.01); H01L 27/14689 (2013.01);
Abstract

In order to reduce dark current and pixel readout noise in an image sensor, pixels may include a p-type hole-based pinned photodiode. Charge stored in the p-type pinned photodiode may be transferred to a p-type floating diffusion (FD) node and read out by pixel circuitry that uses p-channel metal oxide-semiconductor field-effect transistors (p-channel MOSFET). Additionally, the pixel circuitry may be split across multiple wafers that are connected by metal interconnect layers. This arrangement may enable the pixel photodiode to have a larger size than if all of the pixel circuitry was in a single wafer.


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