The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2017

Filed:

Feb. 16, 2016
Applicant:

Korea Advanced Institute of Science and Technology, Daejeon, KR;

Inventors:

Yang-Kyu Choi, Daejeon, KR;

Jun-Young Park, Daejeon, KR;

Byung-Hyun Lee, Daejeon, KR;

Dae-Chul Ahn, Daejeon, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 11/24 (2006.01); H01L 27/108 (2006.01); H01L 29/06 (2006.01); H01L 29/165 (2006.01); H01L 29/16 (2006.01); H01L 29/161 (2006.01); H01L 21/265 (2006.01); H01L 21/308 (2006.01); H01L 21/02 (2006.01); H01L 29/423 (2006.01); G11C 11/409 (2006.01); G11C 7/10 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10802 (2013.01); G11C 7/1072 (2013.01); G11C 11/409 (2013.01); H01L 21/02529 (2013.01); H01L 21/02532 (2013.01); H01L 21/26513 (2013.01); H01L 21/3081 (2013.01); H01L 21/3086 (2013.01); H01L 29/0673 (2013.01); H01L 29/161 (2013.01); H01L 29/165 (2013.01); H01L 29/1608 (2013.01); H01L 29/42392 (2013.01);
Abstract

A multi-bit capacitorless DRAM according to the embodiment of the present invention may be provided that includes: a substrate; a source and a drain formed on the substrate; a plurality of nanowire channels formed on the substrate; a gate insulation layer formed in the plurality of nanowire channels; and a gate formed on the gate insulation layer. Two or more nanowire channels among the plurality of nanowire channels have different threshold voltages. Each of the nanowire channels includes: a silicon layer; a first epitaxial layer which is formed to surround the silicon layer; and a second epitaxial layer which is formed to surround the first epitaxial layer. As a result, the high integration multi-bit capacitorless DRAM which operates at multi-bits can be implemented and a performance of accumulating excess holes can be improved by using energy band gap.


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