The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2017
Filed:
Feb. 08, 2016
Applicant:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Inventors:
Nobuhiro Yamamoto, Yokohama Kanagawa, JP;
Yousuke Hisakuni, Zama Kanagawa, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/367 (2006.01); H01L 27/108 (2006.01); H01L 27/115 (2017.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/3107 (2013.01); H01L 23/49551 (2013.01); H01L 24/14 (2013.01); H01L 27/108 (2013.01); H01L 27/115 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/351 (2013.01);
Abstract
A semiconductor device includes a housing, a substrate housed in and fixed to the housing, and a semiconductor module package disposed on a surface of the substrate. A protrusion is formed on the housing, protrudes towards the substrate, located adjacent to the semiconductor module package, and directly or indirectly urges the substrate in a direction away from the protrusion.