The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2017
Filed:
Oct. 10, 2016
Sii Semiconductor Corporation, Chiba-shi, Chiba, JP;
Noriyuki Kimura, Chiba, JP;
Abstract
A first resin encapsulated body () and a second resin encapsulated body () are stacked to form a resin-encapsulated semiconductor device. The first resin encapsulated body () includes: a first semiconductor element (); an external terminal (); inner wiring (); and a first resin () for covering those components, at least a rear surface of the external terminal (), a rear surface of the semiconductor element (), and a surface of the inner wiring () are exposed from the first resin (). The second resin encapsulated body () includes: a second semiconductor element () having an electrode pad formed on a surface thereof; a second resin () for covering the second semiconductor element; and a metal body connected to the electrode pad, and is partly exposed from the second resin. The inner wiring and the metal body are electrically connected to each other.