The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2017
Filed:
Nov. 08, 2013
Osram Opto Semiconductors Gmbh, Regensburg, DE;
Mathias Kaempf, Burglengenfeld, DE;
OSRAM Opto Semiconductors GmbH, Regensburg, DE;
Abstract
A method for singulating an assemblage () into a plurality of semiconductor chips () is specified, wherein an assemblage comprising a carrier (), a semiconductor layer sequence () and a metallic layer () is provided. Separating trenches () are formed in the carrier. The assemblage is subjected to mechanical loading, with the result that the metallic layer breaks along the separating trenches and the assemblage is singulated into semiconductor chips, wherein the singulated semiconductor chips each have part of the semiconductor layer sequence, of the carrier and of the metallic layer. A semiconductor chip () is furthermore specified.