The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2017

Filed:

May. 28, 2015
Applicant:

Berliner Glas Kgaa Herbert Kubatz Gmbh & Co., Berlin, DE;

Inventor:

Alexander Stein, Berlin, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); Y10T 156/10 (2015.01);
Abstract

Production of a holding apparatus () for electrostatically holding a component, e.g., silicon wafer (), includes connecting plate-type first holding element () and plate-type core element (), first holding element () having first electrode device () and spanning support surface for receiving component (), and the connecting includes the steps: providing liquid adhesive to at least one of the mutually facing surfaces of first holding element () and core element (), aligning first holding element () with first forming tool () such that support surface is matched to predetermined master surface () of first forming tool (), and curing the adhesive, wherein first adhesive connecting layer () is formed, which has thickness variations constituted by form deviations between support surface and at least one of the mutually facing surfaces. Also described is a holding apparatus () configured to electrostatically hold a component, e.g., silicon wafer ().


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