The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2017

Filed:

Jan. 24, 2014
Applicant:

Sulzer Metaplas Gmbh, Bergisch Gladbach, DE;

Inventors:

Joerg Vetter, Bergisch Gladbach, DE;

Stefan Esser, Aachen, DE;

Juergen Mueller, Olpe, DE;

Georg Erkens, Aachen, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); H01J 37/34 (2006.01); C23C 14/24 (2006.01); C23C 14/32 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
H01J 37/3414 (2013.01); C23C 14/243 (2013.01); C23C 14/325 (2013.01); C23C 14/3407 (2013.01); H01J 37/32055 (2013.01); H01J 37/32614 (2013.01); H01J 37/3423 (2013.01); H01J 37/3435 (2013.01); H01J 37/3497 (2013.01);
Abstract

Evaporation source, in particular for use in a sputtering process or in a vacuum arc evaporation process, preferably a cathode vacuum arc evaporation process. The evaporation source includes an inner base body which is arranged in an outer carrier body and which is arranged with respect to the outer carrier body such that a cooling space in flow communication with an inlet and an outlet is formed between the base body and the carrier body. In accordance with the invention, the cooling space includes an inflow space and an outflow space, and the inflow space is in flow communication with the outflow space via an overflow connection for the cooling of the evaporation source such that a cooling fluid can be conveyed from the inlet via the inflow space the overflow connection and the outflow space to the outlet.


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