The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2017
Filed:
Jul. 25, 2013
Hitachi Chemical Company, Ltd., Chiyoda-ku, Tokyo, JP;
Takashi Naito, Tokyo, JP;
Shinichi Tachizono, Tokyo, JP;
Kei Yoshimura, Tokyo, JP;
Yuji Hashiba, Tokyo, JP;
Motomune Kodama, Tokyo, JP;
Masanori Miyagi, Tokyo, JP;
Takuya Aoyagi, Tokyo, JP;
Yuichi Sawai, Tokyo, JP;
Tadashi Fujieda, Tokyo, JP;
Takeshi Tsukamoto, Tokyo, JP;
Hajime Murakami, Tokyo, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
An electronic component has an organic member between two transparent substrates, in which outer peripheral portions of the two transparent substrates are bonded by a sealing material containing to melting glass. The low melting glass contains vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of oxides. The sealing material is formed of a sealing material paste which contains the low melting glass, a resin binder and a solvent, the low melting glass containing vanadium oxide, tellurium oxide, iron oxide and phosphoric acid, and satisfies the following relations (1) and (2) in terms of the oxides. Thereby, thermal damages to an organic element or an organic material contained in the electronic component can be reduced and an electronic component having a glass bonding layer of high reliability can be produced efficiently.VO+TeO+FeO+PO≧90(mass %)  (1)VO>TeO>FeO>PO(mass %)  (2)