The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2017
Filed:
Dec. 10, 2014
Applicant:
Cyntec Co., Ltd., Hsinchu, TW;
Inventors:
Lan-Chin Hsieh, Kaohsiung, TW;
Roger Hsieh, Hsinchu County, TW;
Yu-Ching Kuo, Miaoli County, TW;
Chun-Tiao Liu, Hsinchu, TW;
Assignee:
CYNTEC CO., LTD., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
H01F 41/04 (2006.01); H01F 41/00 (2006.01); H01F 3/10 (2006.01); H01F 17/04 (2006.01); H01F 27/02 (2006.01);
U.S. Cl.
CPC ...
H01F 41/005 (2013.01); H01F 3/10 (2013.01); H01F 17/04 (2013.01); H01F 17/045 (2013.01); H01F 27/022 (2013.01); H01F 2017/048 (2013.01); Y10T 29/49073 (2015.01);
Abstract
A method to form a choke is disclosed, wherein the method comprises: encapsulating a hollow coil by a molding body; forming a first core, wherein the first core comprises a pillar; and disposing at least one first portion of the pillar inside the encapsulated hollow coil. The method avoids the overflow or vertical flow issue during a molding process for encapsulating a coil that has been wound on a core already.