The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2017

Filed:

Aug. 05, 2015
Applicant:

Viking Tech Corporation, Hsinchu County, TW;

Inventors:

Chi-Yu Lu, Hsinchu County, TW;

Chien-Ming Shao, Hsinchu County, TW;

Chien-Chung Yu, Hsinchu County, TW;

Guan-Min Zeng, Hsinchu County, TW;

Assignee:

VIKING TECH CORPORATION, Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C 3/06 (2006.01); H01C 1/028 (2006.01); H01C 17/02 (2006.01);
U.S. Cl.
CPC ...
H01C 1/028 (2013.01); H01C 17/02 (2013.01);
Abstract

A micro-resistance structure with high bending strength is disclosed. The micro-resistance structure with high bending strength comprises a multi-layer metallic substrate; a patterned electrode layer disposed on a lower surface of the multi-layer metallic substrate; an encapsulant layer covering a portion of the multi-layer metallic substrate, wherein the encapsulant layer is substantially made of a flexible resin ink; and two external electrodes, which are electrically insulated from each other, covering the exposed portion of the multi-layer metallic substrate. The abovementioned structure is characterized in high bendability and applicable to wearable devices. A manufacturing method and a semi-finished structure of the micro-resistance structure with high bending strength are also disclosed herein.


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