The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2017

Filed:

Jan. 23, 2013
Applicant:

United Technologies Corporation, Hartford, CT (US);

Inventors:

Eli Cole Warren, Wethersfield, CT (US);

Jerusalem Negash, Wethersfield, CT (US);

Assignee:

United Technologies Corporation, Farmington, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 27/26 (2006.01); G01B 7/14 (2006.01); G01V 3/08 (2006.01); B05D 1/08 (2006.01); B05D 1/32 (2006.01); B05D 5/02 (2006.01); B32B 37/24 (2006.01); B23K 1/00 (2006.01); B32B 38/04 (2006.01); B23K 31/02 (2006.01); H05K 3/10 (2006.01); G01V 13/00 (2006.01); H03K 17/955 (2006.01); G01B 7/16 (2006.01);
U.S. Cl.
CPC ...
G01V 3/088 (2013.01); B05D 1/08 (2013.01); B05D 1/32 (2013.01); B05D 5/02 (2013.01); B23K 1/0016 (2013.01); B23K 31/02 (2013.01); B32B 37/24 (2013.01); B32B 38/04 (2013.01); G01V 13/00 (2013.01); H03K 17/955 (2013.01); H05K 3/10 (2013.01); B32B 2037/243 (2013.01); B32B 2038/047 (2013.01); B32B 2307/202 (2013.01); B32B 2457/00 (2013.01); G01B 7/22 (2013.01); H03K 2217/960755 (2013.01); Y10T 29/49156 (2015.01); Y10T 156/1056 (2015.01);
Abstract

A proximity sensor includes a lead supported on an outer surface of a case structure and a sensor wire that extends from the lead and through an opening in the case structure. The sensor is formed by applying alternating layers of electrically conductive and non-conductive materials in a non-cured state. A base non-conductive layer is applied to an inner surface of the case structure around the sensor wire in a non-cured state. Once cured, a conductive layer is deposited onto the base non-conductive layer and encapsulates the sensor wire. A cover non-conductive layer is then deposited over portions of the conductive layer to insulate the conductive layer. Portions of the non-conductive layer are then removed such that an area of the conductive layer is exposed to define a sensor area.


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