The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2017

Filed:

Apr. 21, 2014
Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Hidenori Matsuo, Hadano, JP;

Takashi Sasamuro, Yamato, JP;

Hideki Kondo, Yokohama, JP;

Assignee:

Nichia Corporation, Anan-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21K 5/00 (2006.01); F21K 9/00 (2016.01); H01S 5/02 (2006.01); G03B 21/20 (2006.01); H01S 5/024 (2006.01); H01S 5/40 (2006.01);
U.S. Cl.
CPC ...
F21K 9/00 (2013.01); H01S 5/02 (2013.01); H01S 5/0202 (2013.01); G03B 21/2033 (2013.01); H01S 5/02469 (2013.01); H01S 5/4025 (2013.01);
Abstract

A light source apparatus of the present invention has a plurality of semiconductor laser devices and a holding member; the semiconductor laser device includes: a semiconductor laser element; a placing body on which the semiconductor laser element is mounted; a substrate on which the placing body is biased to one side thereof; and a pair of terminals electrically connected to the semiconductor laser element, biased to the other side of the substrate and protruding from the substrate, and the holding member includes: holes aligned in at least a pair of rows; a thin-walled section on which the holes are arranged, the thin-walled section being formed by providing at least a pair of depressions on the other side; and a thick-walled section provided adjacent to the thin-walled section. The semiconductor laser device is mounted on one side of the holding member and the placing body of the semiconductor laser device is disposed on the thick-walled section, and the pair of terminals are exposed through the holes from the other side of the holding member.


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