The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2017

Filed:

Jan. 11, 2013
Applicant:

Nippon Steel & Sumitomo Metal Corporation, Tokyo, JP;

Inventors:

Toshiki Nonaka, Tokyo, JP;

Satoshi Kato, Tokyo, JP;

Kaoru Kawasaki, Tokyo, JP;

Toshimasa Tomokiyo, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 38/02 (2006.01); C22C 38/04 (2006.01); C22C 38/06 (2006.01); C22C 38/12 (2006.01); C22C 38/14 (2006.01); C22C 38/18 (2006.01); C21D 8/02 (2006.01); C23C 2/06 (2006.01); C23C 2/12 (2006.01); C23C 2/26 (2006.01); C23C 2/28 (2006.01); C23C 2/02 (2006.01); C21D 9/46 (2006.01); C22C 38/00 (2006.01); C22C 38/08 (2006.01); C22C 38/16 (2006.01); C22C 38/22 (2006.01); C22C 38/28 (2006.01); C22C 38/32 (2006.01); C22C 38/38 (2006.01); C21D 1/673 (2006.01);
U.S. Cl.
CPC ...
C21D 8/0263 (2013.01); C21D 8/0226 (2013.01); C21D 8/0236 (2013.01); C21D 8/0284 (2013.01); C21D 9/46 (2013.01); C22C 38/00 (2013.01); C22C 38/001 (2013.01); C22C 38/002 (2013.01); C22C 38/005 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C22C 38/08 (2013.01); C22C 38/12 (2013.01); C22C 38/14 (2013.01); C22C 38/16 (2013.01); C22C 38/18 (2013.01); C22C 38/22 (2013.01); C22C 38/28 (2013.01); C22C 38/32 (2013.01); C22C 38/38 (2013.01); C23C 2/02 (2013.01); C23C 2/06 (2013.01); C23C 2/12 (2013.01); C23C 2/26 (2013.01); C23C 2/28 (2013.01); C21D 1/673 (2013.01); C21D 2211/008 (2013.01); Y10T 428/12757 (2015.01); Y10T 428/12799 (2015.01);
Abstract

In a hot stamped steel, when [C] represents an amount of C (mass %), [Si] represents an amount of Si (mass %), and [Mn] represents an amount of Mn (mass %), an expression of 5×[Si]+[Mn])/[C]>10 is satisfied, a metallographic structure includes 80% or more of a martensite in an area fraction, and optionally, further includes one or more of 10% or less of a pearlite in an area fraction, 5% or less of a retained austenite in a volume ratio, 20% or less of a ferrite in an area fraction, and less than 20% of a bainite in an area fraction, TS×λ, which is a product of TS that is a tensile strength and λ that is a hole expansion ratio is 50000 MPa·% or more, and a hardness of the martensite measured with a nanoindenter satisfies H2/H1<1.10 and σHM<20.


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