The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2017
Filed:
May. 27, 2014
Applicant:
Idemitsu Kosan Co., Ltd., Chiyoda-ku, JP;
Inventors:
Kazuhiro Hashima, Chiba, JP;
Tomoaki Takebe, Chiba, JP;
Yutaka Minami, Chiba, JP;
Masao Inoue, Sodegaura, JP;
Kenji Kobayashi, Chiba, JP;
Assignee:
IDEMITSU KOSAN CO., LTD., Chiyoda-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
C08F 110/06 (2006.01); C09J 123/12 (2006.01); C09J 5/06 (2006.01); C09J 201/00 (2006.01); A61L 15/24 (2006.01); A61L 15/58 (2006.01); C09J 5/00 (2006.01); C08F 4/659 (2006.01);
U.S. Cl.
CPC ...
C09J 123/12 (2013.01); A61L 15/24 (2013.01); A61L 15/58 (2013.01); C08F 110/06 (2013.01); C09J 5/00 (2013.01); C09J 5/06 (2013.01); C09J 201/00 (2013.01); C08F 4/65908 (2013.01); C08F 4/65912 (2013.01); C09J 2201/61 (2013.01); C09J 2400/263 (2013.01); C09J 2423/00 (2013.01);
Abstract
Provided is a hot-melt adhesive which satisfies both solidification rate and adhesiveness. A base polymer for a hot-melt adhesive which satisfies the following (1) and (2): (1) a modulus of elasticity in tension at 23° C. is 400 MPa or less; and (2) a semi-crystallization time at 23° C. is 20 minutes or less.