The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2017

Filed:

May. 28, 2013
Applicant:

Kao Corporation, Tokyo, JP;

Inventors:

Ryo Shibutani, Wakayama, JP;

Hiroaki Kishimoto, Sakai, JP;

Assignee:

KAO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L 67/04 (2006.01); C08K 5/3492 (2006.01); C08K 5/523 (2006.01); C08K 5/29 (2006.01); B29C 45/00 (2006.01); C08K 5/00 (2006.01); C08L 101/16 (2006.01); B29K 67/00 (2006.01);
U.S. Cl.
CPC ...
C08L 67/04 (2013.01); B29C 45/0001 (2013.01); C08K 5/00 (2013.01); C08K 5/29 (2013.01); C08K 5/34922 (2013.01); C08K 5/523 (2013.01); B29K 2067/046 (2013.01); C08L 101/16 (2013.01); C08L 2201/02 (2013.01); C08L 2205/24 (2013.01);
Abstract

A method for producing an injection-molded article of a polylactic acid resin composition, including filling a melt-kneaded product of a polylactic acid resin composition containing a polylactic acid resin, a plasticizer containing a polyoxyalkylene group or an oxyalkylene group, and a mold releasing agent having a melting point of from 20° to 75° C. in an injection-molding machine to mold in a die, wherein the method is characterized in that the above-mentioned injection-molding machine comprises a cylinder at least a part of which has a set temperature of 200° C. or higher, that the die has a surface temperature of 85° C. or higher, and that the die has a surface roughness of 1.0 μm or less.


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