The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 08, 2017

Filed:

Feb. 04, 2015
Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Jochen Franz, Reutlingen, DE;

Simon Armbruster, Wannweil, DE;

Helmut Grutzeck, Kusterdingen, DE;

Joerg Muchow, Reutlingen, DE;

Frederic Njikam Njimonzie, Reutlingen, DE;

Andreas Duell, Stuttgart, DE;

Johannes Baader, Wannweil, DE;

Stefan Liebing, Kiebingen, DE;

Rainer Straub, Ammerbuch, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B81B 1/00 (2006.01); B81C 1/00 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00277 (2013.01); B81B 7/007 (2013.01); B81B 7/0035 (2013.01); B81B 2207/095 (2013.01); B81B 2207/097 (2013.01); B81C 2203/0109 (2013.01);
Abstract

A micromechanical component includes: a hermetically sealed housing; a first functional element that is situated inside the housing; a first structured electrically conductive layer that contacts the first functional element and that is situated inside the housing; and a second structured electrically conductive layer, the first conductive layer being electrically contacted via the second conductive layer, and the second conductive layer being electrically contacted laterally through the housing via a hermetic through-contacting in the second conductive layer.


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