The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2017
Filed:
Aug. 24, 2016
Nissei Plastic Industrial Co., Ltd., Nagano, JP;
Atsushi Murata, Nagano, JP;
Daiki Tanemura, Nagano, JP;
Hozumi Yoda, Nagano, JP;
Nobusuke Takahashi, Nagano, JP;
Abstract
A mold clamping apparatus includes a fixed platen, a mold clamping cylinder, a movable platen moved by the mold clamping cylinder toward the fixed platen, and a mold opening/closing actuator for moving the movable platen or the mold clamping cylinder. The mold clamping apparatus further includes a mold thickness adjustment cylinder provided between the mold clamping cylinder and the movable platen, the mold thickness adjustment cylinder being configured to generate an axial force larger than an axial force in an expanding direction of the mold opening/closing actuator and smaller than an axial force in a contracting direction of the mold clamping cylinder.