The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2017
Filed:
May. 13, 2015
Hexcel Corporation, Dublin, CA (US);
Bruno Boursier, Dublin, CA (US);
Hexcel Composites Limited, Cambridge, GB;
Abstract
Preforms for use in molding composite parts are made directly from composite chips that are composed of fibers and an uncured thermosetting resin. Cold composite chips are formed into a stream of non-agglomerating chips that is used to fill the cavity of a preform tool. The non-agglomerating chips flow into the preform tool cavity to form a population of non-cohesive composite chips. The non-cohesive composite chips are then heated to form a preform made up of a consolidated population of cohesive composite chips in which the non-sticky uncured thermosetting resin of the non-cohesive chips has been converted to a sticky uncured thermosetting resin.