The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2017
Filed:
Jun. 29, 2015
Applicant:
Lg Siltron Incorporated, Gumi-si, Gyeongsangbuk-do, KR;
Inventors:
Kee Yun Han, Gumi-si, KR;
Eun Suck Choi, Gumi-si, KR;
Assignee:
LG Siltron Incorporated, Gumi-Si, Gyeongsangbuk-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/08 (2012.01); B24B 49/10 (2006.01); B24B 37/26 (2012.01); B24B 7/22 (2006.01);
U.S. Cl.
CPC ...
B24B 49/10 (2013.01); B24B 7/228 (2013.01); B24B 37/08 (2013.01); B24B 37/26 (2013.01);
Abstract
Disclosed is a wafer polishing apparatus including a base, a lower surface plate disposed on the upper surface of the base, an upper surface plate disposed on the lower surface plate and a first shape adjustment unit configured to deform the shape of the lower surface of the upper surface plate so that the lower surface of the upper surface plate has one of a concave shape, a flat shape and a convex shape in a first direction, and the first direction is a direction from the lower surface plate to the upper surface plate.