The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 08, 2017
Filed:
Sep. 19, 2007
Device to be implanted in human or animal tissue and method for implanting and assembling the device
Marcel Aeschlimann, Ligerz, CH;
Laurent Torriani, Lamboing, CH;
Andrea Muller, Winterthur, CH;
Thomas Knecht, Hausen, CH;
Philipp Seiler, Niederdorf, CH;
Urs Weber, Evilard, CH;
Christopher Rast, Biel, CH;
Jorg Mayer, Niederlenz, CH;
Stephanie Mehl, Zug, CH;
Milica Berra, Schlieren, CH;
Marcel Aeschlimann, Ligerz, CH;
Laurent Torriani, Lamboing, CH;
Andrea Muller, Winterthur, CH;
Thomas Knecht, Hausen, CH;
Philipp Seiler, Niederdorf, CH;
Urs Weber, Evilard, CH;
Christopher Rast, Biel, CH;
Jorg Mayer, Niederlenz, CH;
Stephanie Mehl, Zug, CH;
Milica Berra, Schlieren, CH;
WOODWELDING AG, Stansstad, CH;
Abstract
An implant or endoprosthesis suitable to be implanted in human or animal tissue includes two (or more than two) parts to be joined in situ. Each one of the parts includes a joining location, the two joining locations facing each other when the device parts are positioned for being joined together, wherein one of the joining locations includes a material which is liquefiable by mechanical vibration and the other one of the joining locations includes a material which is not liquefiable by mechanical vibration and a structure (e.g. undercut cavities or protrusions) suitable for forming a positive fit connection with the liquefiable material. The joining process is effected by pressing the two device parts against each other and by applying ultrasonic vibration to one of the device parts when the two parts are positioned relative to each other such that the two joining locations are in contact with each other.