The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2017

Filed:

Feb. 25, 2011
Applicants:

Jian Yin, San Jose, CA (US);

Nikhil Vishwanath Kelkar, Saratoga, CA (US);

Michael Althar, Melbourne, FL (US);

Inventors:

Jian Yin, San Jose, CA (US);

Nikhil Vishwanath Kelkar, Saratoga, CA (US);

Michael Althar, Melbourne, FL (US);

Assignee:

INTERSIL AMERICAS LLC, Milpitas, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0007 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/48091 (2013.01); Y10T 29/49002 (2015.01);
Abstract

An embodiment of a power-supply module includes a package having sides, a first power-supply component disposed in the package, and an electromagnetic-interference (EMI) shield disposed adjacent to two sides of the package. For example, such a module may include component-mounting platforms (e.g., a lead frame or printed circuit board) on the top and bottom sides of the module, and these platforms may provide a level of EMI shielding specified for a particular application. Consequently, such a module may provide better EMI shielding than modules with shielding along only one side (e.g., the bottom) of the module. Moreover, if the module components are mounted to, or otherwise thermally coupled to, the shielding platforms, then the module may provide multi-side cooling of the components.


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