The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2017
Filed:
Apr. 03, 2014
Denso Corporation, Kariya, Aichi-pref., JP;
Hiroaki Ando, Kariya, JP;
Kiminobu Inayoshi, Kariya, JP;
Tetsuichi Takeuchi, Chiryu, JP;
Naoto Makino, Anjo, JP;
Tetsuya Sueyoshi, Okazaki, JP;
Kenichi Katoh, Kasugai, JP;
Keisuke Nishio, Tokai, JP;
DENSO CORPORATION, Kariya, Aichi-pref., JP;
Abstract
A vehicular electronic device has a semiconductor package and a multilayer wiring board. An electrode pad of the multilayer wiring board, to which a signal terminal of the semiconductor package is soldered, has a wiring pattern in an inner layer of the multilayer wiring board. A solder resist is applied and spaced from a periphery of the electrode pad to the exterior. The signal terminal is soldered to the electrode pad to cover an upper surface and an upper end of a side surface of the electrode pad. As a result, a crack is less likely to occur in solder connected to the signal terminal. Therefore, the signal terminal can be electrically connected with high reliability even when the signal terminal is provided in the semiconductor package with a small number.