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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9723718 B1

PDFFull Text
Date of Patent:
Aug. 01, 2017

Filed:

Aug. 06, 2014

Electronic component mounting device and semiconductor device including the same

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Taichi Obara, Tokyo, JP;

Rei Yoneyama, Tokyo, JP;

Takami Otsuki, Tokyo, JP;

Eiju Shitama, Fukuoka, JP;

Assignee:

Mitsubishi Electric Corporation, Tokyo, JP;

Attorney:

Studebaker & Brackett PC

Primary Examiner:

Binh Tran

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H01L 23/15 (2006.01); H05K 3/34 (2006.01); H05K 7/12 (2006.01); H05K 7/00 (2006.01); H01L 23/13 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); H01L 23/15 (2013.01); H01L 23/49838 (2013.01); H05K 1/11 (2013.01); H05K 1/111 (2013.01); H05K 3/3442 (2013.01); H01L 23/13 (2013.01); H01L 23/3735 (2013.01); H01L 23/49827 (2013.01); H01L 23/49844 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/19105 (2013.01); H05K 1/186 (2013.01); H05K 1/188 (2013.01); H05K 2201/09072 (2013.01); H05K 2201/09745 (2013.01); H05K 2201/10 (2013.01); H05K 2201/1059 (2013.01); H05K 2201/10174 (2013.01); H05K 2201/10636 (2013.01); H05K 2201/10651 (2013.01); H05K 2201/10674 (2013.01); H05K 2201/10689 (2013.01); Y02P 70/611 (2015.11); Y02P 70/613 (2015.11);
Abstract

An electronic component mounting device includes an insulating substrate having a metal pattern formed thereon and a MELF electronic component. The MELF electronic component is fitted into a first receiving portion configured with the metal pattern and the insulating substrate exposed from a lacking portion of the metal pattern. The electronic component mounting device further includes a conductive member formed between the MELF electronic component and the metal pattern, and the conductive member is not formed between the MELF electronic component and the insulating substrate.

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