The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2017

Filed:

Aug. 05, 2015
Applicant:

Mc10, Inc., Lexington, MA (US);

Inventors:

Brian David Elolampi, Belmont, MA (US);

Roozbeh Ghaffari, Cambridge, MA (US);

Bassel de Graff, San Juan, TT;

William J. Arora, Bellevue, WA (US);

Xiaolong Hu, Cambridge, MA (US);

Assignee:

MC10, Inc., Lexington, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01L 21/683 (2006.01); H05K 3/46 (2006.01); H05K 3/06 (2006.01); H05K 1/11 (2006.01); H05K 1/03 (2006.01); H01L 23/13 (2006.01); H01L 25/065 (2006.01); H01L 25/07 (2006.01); H01L 25/00 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0278 (2013.01); H01L 21/6835 (2013.01); H01L 23/13 (2013.01); H01L 23/4985 (2013.01); H01L 25/0655 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H05K 1/0326 (2013.01); H05K 1/0346 (2013.01); H05K 1/115 (2013.01); H05K 3/067 (2013.01); H05K 3/4644 (2013.01); H01L 23/5389 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2924/1461 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0154 (2013.01);
Abstract

Flexible electronic structure and methods for fabricating flexible electronic structures are provided. An example method includes applying a first layer to a substrate, creating a plurality of vias through the first layer to the substrate, and applying a second polymer layer to the first layer such that the second polymer forms anchors contacting at least a portion of the substrate. At least one electronic device layer is disposed on a portion of the second polymer layer. At least one trench is formed through the second polymer layer to expose at least a portion of the first layer. At least a portion of the first layer is removed by exposing the structure to a selective etchant to providing a flexible electronic structure that is in contact with the substrate. The electronic structure can be released from the substrate.


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