The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2017

Filed:

Jan. 12, 2016
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Jae Wook Ahn, Seoul, KR;

Je Kyung Park, Seoul, KR;

Sun Min Hwang, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); B60R 11/04 (2006.01); G03B 17/08 (2006.01); H01L 31/0203 (2014.01); G01D 11/24 (2006.01);
U.S. Cl.
CPC ...
H04N 5/2252 (2013.01); B60R 11/04 (2013.01); G03B 17/08 (2013.01); H04N 5/2253 (2013.01); H04N 5/2254 (2013.01); H04N 5/2257 (2013.01); G01D 11/245 (2013.01);
Abstract

The exemplary embodiment of the present disclosure relates to a camera module including a rear-opened front body, a rear body coupled to a rear side of the front body to form an inner space, a lens part coupled to the front body, an image sensor accommodated at the inner space to convert a light having passed the lens part to an electrical signal, a PCB (Printed Circuit Board) accommodated at the inner space and mounted with the image sensor, and a closed curve-shaped packing member interposed between the front body and the rear body, wherein the packing member includes a support part extensively formed from the packing member to an inner side, and the front body or the rear body includes a support part accommodation groove having a shape corresponding to that of the support part, whereby adhesionability during assembly of packing member can be maximized to thereby minimize an installation defect, a depressed or stamped phenomenon of a packing member that may occur during assembly process.


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