The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2017

Filed:

Dec. 29, 2015
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Fengfeng Tao, Niskayuna, NY (US);

Michael Joseph Schutten, Niskayuna, NY (US);

Jeffrey Joseph Nasadoski, Gloversville, NY (US);

Maja Harfman-Todorovic, Niskayuna, NY (US);

John Stanley Glaser, Schenectady, NY (US);

Assignee:

GENERAL ELECTRIC COMPANY, Niskayuna, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03K 17/687 (2006.01); H03K 17/16 (2006.01); H05K 3/36 (2006.01); H03K 17/691 (2006.01);
U.S. Cl.
CPC ...
H03K 17/162 (2013.01); H03K 17/691 (2013.01); H05K 3/36 (2013.01);
Abstract

A system includes a SiC semiconductor power device; a power supply board that is configured to provide power to a first gate driver board via a connector; the first gate driver board that is coupled and configured to provide current to the SiC semiconductor power device, wherein the first gate driver board is coupled to the power supply board via the connector, and wherein the first gate driver board is separated from the power supply board; and an interconnect board that is coupled to the first gate driver board, wherein the interconnect board is configured to couple the first gate driver board a second gate driver board.


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