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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9722568 B1

PDFFull Text
Date of Patent:
Aug. 01, 2017

Filed:

Jul. 06, 2016

Thin film surface mount components

Applicant:

Avx Corporation, Fountain Inn, SC (US);

Inventors:

Gheorghe Korony, Myrtle Beach, SC (US);

Andrew P. Ritter, Simpsonville, SC (US);

Assignee:

AVX Corporation, Fountain Inn, SC (US);

Attorney:

Dority & Manning, P.A.

Primary Examiner:

Timothy Thompson

Assistant Examiner:

Rhadames J Alonzo Miller

Int. Cl.
CPC ...
B32B 37/00 (2006.01); H03H 7/01 (2006.01); H01C 1/148 (2006.01); H01C 7/00 (2006.01); H01F 5/00 (2006.01); H01G 4/224 (2006.01); H01G 4/248 (2006.01); H01G 4/33 (2006.01); H01F 27/28 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H03H 1/00 (2006.01);
U.S. Cl.
CPC ...
H03H 7/17 (2013.01); H01C 1/148 (2013.01); H01C 7/006 (2013.01); H01F 5/003 (2013.01); H01F 27/2804 (2013.01); H01G 4/224 (2013.01); H01G 4/248 (2013.01); H01G 4/33 (2013.01); H03H 7/0115 (2013.01); H05K 1/111 (2013.01); H05K 1/186 (2013.01); H05K 3/467 (2013.01); H05K 3/4611 (2013.01); H05K 3/4697 (2013.01); H01F 2027/2809 (2013.01); H01L 2924/0002 (2013.01); H03H 2001/0085 (2013.01); Y10T 29/49124 (2015.01);
Abstract

Surface mount components and related methods involve thin film circuits between first and second insulating substrates. The thin film circuits may include passive components, including resistors, capacitors, inductors, arrays of such components, networks, or filters of multiple passive components. Such thin film circuit(s) can be sandwiched between first and second insulating substrates with internal conductive pads which are exposed to the outside of the surface mount component and electrically connected to external terminations. External terminations may include at least one layer of conductive polymer. Optional shield layers may protect the surface mount components from signal interference. A cover substrate may be formed with a plurality of conductive elements that are designed to generally align with the conductive pads such that conductive element portions are exposed in groups along surfaces of a device.

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