logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9722509 B1

PDFFull Text
Date of Patent:
Aug. 01, 2017

Filed:

Feb. 26, 2016

Hybrid circuit device

Applicant:

Semiconductor Components Industries, Llc, Phoenix, AZ (US);

Inventors:

Shigeaki Mashimo, Maebashi, JP;

Fumio Horiuchi, Ashikaga, JP;

Kiyoaki Kudo, Gunma, JP;

Akira Sakurai, Tatebayashi, JP;

Yuhki Inagaki, Kumagaya, JP;

Assignee:

SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US);

Attorneys:

Polansky & Associates, P.L.L.C.

Paul J. Polansky

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 7/00 (2006.01); H02M 7/537 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/433 (2006.01); H01L 23/495 (2006.01); H01L 25/07 (2006.01); H01L 21/48 (2006.01); H01L 23/29 (2006.01); H01L 25/18 (2006.01); H01L 25/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H02M 7/537 (2013.01); H01L 21/4825 (2013.01); H01L 21/56 (2013.01); H01L 21/565 (2013.01); H01L 23/293 (2013.01); H01L 23/3121 (2013.01); H01L 23/4334 (2013.01); H01L 23/49531 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 24/85 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H05K 1/0203 (2013.01); H05K 1/181 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48139 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); Y10T 29/4916 (2015.01);
Abstract

A circuit device comprises a circuit board and a plurality of leads each comprising an island portion, a bonding portion elevated from the island portion, and an oblique slope portion connecting the island portion and the bonding portion, and a plurality of circuit elements mounted on the island portions so as to be connected to corresponding bonding portions through wirings. Two leads are adapted to be connected to positive and negative electrodes of a direct-current power source, and yet another lead is an output lead adapted to output alternating-current power. One electrode provided on a transistor mounted on an island portion of the second input lead is connected to a bonding portion of the output lead through a wiring, and another electrode provided on a transistor mounted on an island portion of the output lead is connected to a bonding portion of the first input lead through a wiring.

Find Patent Forward Citations

Loading…