The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2017

Filed:

May. 30, 2014
Applicant:

Solus Technologies Limited, Glasgow Central Scotland, GB;

Inventors:

Craig James Hamilton, Glasgow Strathclyde, GB;

Gareth Thomas Maker, Glasgow Strathclyde, GB;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 3/04 (2006.01); H01S 5/024 (2006.01); H01S 3/06 (2006.01); H01S 3/23 (2006.01); H01S 5/022 (2006.01); H01S 5/183 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02469 (2013.01); H01S 3/0604 (2013.01); H01S 5/02256 (2013.01); H01S 5/02476 (2013.01); H01S 5/02484 (2013.01); H01S 3/2308 (2013.01); H01S 5/0222 (2013.01); H01S 5/02423 (2013.01); H01S 5/183 (2013.01);
Abstract

The present invention describes a method and apparatus for mounting a semiconductor disc laser (SDL). In particular there is described a cooling apparatus assembly () for mounting the semiconductor disc laser () the cooling apparatus assembly comprising a crystalline heat spreader () made of diamond, sapphire or SiC and optically contacted to the SDL (). The apparatus further comprises a heatsink () made of copper and a recess () located on a first surface () of the heatsink. A pliable filler material () which may be In or an In alloy is provided within the recess () such that when a sealing plate () is fastened to the heatsink the SDL () is hermetically sealed within the recess. Hermetically sealing the SDL within the recess is found to significantly increase the lifetime of the device comprising the SDL. The heat sink () may be water cooled with pipes () delivering the water. In case the sealing plate () is made from for example Invar, it has an aperture ().


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