The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2017
Filed:
Jan. 08, 2016
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;
Inventor:
Hideaki Nakai, Nagaokakyo, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 8/02 (2016.01); H01M 8/0215 (2016.01); B32B 18/00 (2006.01); H01M 8/0228 (2016.01); H01M 8/0217 (2016.01); H01M 8/124 (2016.01); H01M 2/14 (2006.01); H01M 2/16 (2006.01);
U.S. Cl.
CPC ...
H01M 8/0215 (2013.01); B32B 18/00 (2013.01); H01M 8/0228 (2013.01); H01M 2/145 (2013.01); H01M 2/1646 (2013.01); H01M 2/1686 (2013.01); H01M 8/0217 (2013.01); H01M 2008/1293 (2013.01); Y02P 70/56 (2015.11);
Abstract
A ceramic substrate for an electrochemical element that includes a ceramic layer and a high-thermal-expansion-coefficient material layer that is laminated on the surface of the ceramic layer. The high-thermal-expansion-coefficient material layer has a higher coefficient of thermal expansion than the ceramic layer, and applies compressive stress to the ceramic layer.