The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2017

Filed:

Aug. 25, 2015
Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventors:

Kentaro Morito, Tokyo, JP;

Daiki Ishii, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 49/02 (2006.01); H01L 21/768 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 28/60 (2013.01); H01L 21/76816 (2013.01); H01L 28/40 (2013.01); H01L 27/0207 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A thin film electronic component includes: a substrate; a thin film electrode layer over the substrate; an inorganic insulation layer formed on the thin film electrode layer; an organic insulation layer formed on the inorganic insulation layer; and a lead-out electrode that electrically connects to the thin film electrode layer. The inorganic insulation layer has a through-hole formed therein, so as to expose a portion of the thin film electrode layer. The organic insulation layer has a through-hole formed therein, so as to expose the through-hole in the inorganic insulation layer. The lead-out electrode is formed in the through-hole in the inorganic insulation layer and the through-hole in the organic insulation layer. A shape of a borderline defining the through-hole at a top surface of the organic insulation layer in a plan view has chamfered corners.


Find Patent Forward Citations

Loading…