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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9721904 B1

PDFFull Text
Date of Patent:
Aug. 01, 2017

Filed:

Mar. 24, 2016

Semiconductor packages including a shielding part and methods for manufacturing the same

Applicant:

SK Hynix Inc., Icheon-si Gyeonggi-do, KR;

Inventors:

Seung Ho Kim, Icheon-si, KR;

Soo Won Kang, Seoul, KR;

Jung Tae Jeong, Icheon-si, KR;

Assignee:

SK hynix Inc., Icheon-si, Gyeonggi-do, KR;

Attorney:

William Park & Associates Ltd.

Primary Examiner:

Michael Trinh

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/498 (2006.01); H01L 23/58 (2006.01); H01L 23/31 (2006.01); H01L 29/49 (2006.01); H01L 21/48 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/4853 (2013.01); H01L 23/3128 (2013.01); H01L 23/4985 (2013.01); H01L 23/49838 (2013.01); H01L 23/585 (2013.01); H01L 25/0657 (2013.01); H01L 29/49 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/0652 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A method for manufacturing a semiconductor package and the semiconductor package are provided. The method for manufacturing a semiconductor package may include arranging a conductive elastic plate over a package substrate including through slits disposed along edges of a chip mounting region and a conductive guard rails providing a concave trench shape, and bending the conductive elastic plate. Edge portions of the conductive elastic plate may be inserted into the trenches of the conductive guard rails and supported by the conductive guard rails by a force trying to stretch by the elastic restoring force of the wing portions of the conductive elastic plate.

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