The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2017
Filed:
Apr. 08, 2015
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventor:
Hun Heo, Seoul, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/00 (2006.01); H01L 23/48 (2006.01); H01L 23/528 (2006.01); H01L 27/02 (2006.01); H01L 27/118 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5286 (2013.01); H01L 27/0207 (2013.01); H01L 27/11807 (2013.01); H01L 2027/11881 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A system-on-chip includes a substrate, a plurality of unit cells on the substrate, a first power mesh, and a second power mesh. The first power mesh includes a power rail that is connected to power terminals of the plurality of unit cells and is provided in a first metallization layer. The first power mesh also includes a power strap in a second metallization layer. The second power mesh is provided in a third metallization layer and a fourth metallization layer.