The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2017
Filed:
Oct. 24, 2014
Applicant:
Sharp Kabushiki Kaisha, Osaka-shi, Osaka, JP;
Inventors:
Fumiaki Matsuura, Osaka, JP;
Tomotoshi Satoh, Osaka, JP;
Assignee:
Sharp Kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/8258 (2006.01); H01L 21/78 (2006.01); H01L 21/48 (2006.01); H01L 29/20 (2006.01); H01L 21/683 (2006.01); H01L 23/495 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/4825 (2013.01); H01L 21/6836 (2013.01); H01L 29/2003 (2013.01); H01L 21/8258 (2013.01); H01L 23/49513 (2013.01); H01L 23/544 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68386 (2013.01); H01L 2223/54433 (2013.01); H01L 2223/54453 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83192 (2013.01); H01L 2924/181 (2013.01);
Abstract
A production method for a semiconductor element () includes: a semiconductor element forming step of forming the semiconductor element () including a dielectric film (); a dicing region forming step of forming dicing regions () by removing the dielectric film () in partition regions that partition the semiconductor element (); and a dicing step of dicing the dicing regions ().