The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2017

Filed:

Apr. 12, 2016
Applicants:

Michael A. Marrs, Phoenix, AZ (US);

Emmett M. Howard, Tempe, AZ (US);

Douglas E. Loy, Chandler, AZ (US);

Nicholas Munizza, Gilbert, AZ (US);

Inventors:

Michael A. Marrs, Phoenix, AZ (US);

Emmett M. Howard, Tempe, AZ (US);

Douglas E. Loy, Chandler, AZ (US);

Nicholas Munizza, Gilbert, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/07 (2006.01); H01L 21/683 (2006.01); H01L 21/311 (2006.01); H05K 3/00 (2006.01); H05K 1/03 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 21/31138 (2013.01); H05K 3/007 (2013.01); H01L 2221/6835 (2013.01); H01L 2221/68381 (2013.01); H05K 1/0393 (2013.01); H05K 3/281 (2013.01); H05K 2203/016 (2013.01); H05K 2203/0152 (2013.01); H05K 2203/0191 (2013.01); H05K 2203/1383 (2013.01); Y10T 156/10 (2015.01); Y10T 428/14 (2015.01); Y10T 428/1476 (2015.01); Y10T 428/23914 (2015.04); Y10T 428/24355 (2015.01); Y10T 428/24942 (2015.01); Y10T 428/26 (2015.01); Y10T 428/2848 (2015.01); Y10T 428/31515 (2015.04);
Abstract

Some embodiments include a method. The method can include providing a carrier substrate having an edge. Further, the method can include providing a cross-linking adhesive, and providing a flexible substrate having an edge. Further still, the method can include coupling the flexible substrate to the carrier substrate using the cross-linking adhesive such that at least a portion of the edge of the flexible substrate is recessed from the edge of the carrier substrate and such that the cross-linking adhesive has an exposed portion of the cross-linking adhesive at an offset portion of the first surface of the carrier substrate between the at least the portion of the edge of the flexible substrate and the edge of the carrier substrate. Meanwhile, the method can include etching the exposed portion of the cross-linking adhesive. Other embodiments of related methods and devices are also disclosed.


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