The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9720192 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 01, 2017

Filed:

Feb. 11, 2015
Applicant:

Electronics and Telecommunications Research Institute, Daejeon-si, KR;

Inventors:

Jyung Chan Lee, Daejeon-si, KR;

Eun Gu Lee, Daejeon-si, KR;

Sil Gu Mun, Daejeon-si, KR;

Sang Soo Lee, Daejeon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 10/00 (2013.01); G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
G02B 6/4279 (2013.01);
Abstract

An interface for transmitting a high-speed signal and an optical module including the same. The interface may include a main substrate and a sub-substrate. The main substrate may have at least one high-speed signal line formed on the upper surface of the main substrate. The sub-substrate may have a first conductive line formed on the lower surface thereof so as to adjust high-speed signal transmission characteristics of the high-speed signal line, wherein the first conductive line may be coupled to the upper surface of the main substrate and partially overlap with the high-speed signal line.


Find Patent Forward Citations

Lee, Jyung. (2017). Interface for transmitting high-speed signal and optical module including the same (U.S. Patent No. 9720192). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9720192

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