The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2017

Filed:

Aug. 24, 2016
Applicant:

Multiphoton Optics Gmbh, Wüzburg, DE;

Inventors:

Ruth Houbertz, Wurzburg, DE;

Markus Riester, Seiersberg, AT;

Assignee:

Multiphoton Optics GmbH, Würzburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/36 (2006.01); G02B 6/138 (2006.01); G02B 6/42 (2006.01); G02B 6/30 (2006.01); G02B 6/12 (2006.01);
U.S. Cl.
CPC ...
G02B 6/138 (2013.01); G02B 6/12002 (2013.01); G02B 6/30 (2013.01); G02B 6/4206 (2013.01); G02B 6/4255 (2013.01); G02B 6/4257 (2013.01);
Abstract

A package including optical components has one or more structures with optical input or optical output. An optical interconnection optically connects to the optical input or optical output of the structure(s). A component is provided in which the optical interconnection and the optical input or optical output of the structure(s) are embedded. The component is made of a first material and the optical interconnection of a second material. The first and second materials are chemically identical. The first material has a first primary and/or secondary structure and the second material has a second primary and/or secondary structure. The first primary and/or secondary structure is different from the second primary and/or secondary structure. The refractive indices of the component and of the optical interconnection differ from each other by at least 0.0004 at 850 nm, 1,310 nm, and 1,550 nm, respectively. The optical interconnection is mechanically fixed by the component.


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