The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2017

Filed:

Jun. 28, 2013
Applicant:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, Ibaraki, JP;

Inventors:

Norio Ishitsuka, Tokyo, JP;

Yasuo Onose, Hitachinaka, JP;

Noriyuki Sakuma, Tokyo, JP;

Hiroshi Nakano, Tokyo, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01F 1/692 (2006.01); G01F 1/684 (2006.01);
U.S. Cl.
CPC ...
G01F 1/692 (2013.01); G01F 1/6842 (2013.01); G01F 1/6845 (2013.01);
Abstract

A thermal air flow sensor that offers high flow rate measurement accuracy is provided. The thermal air flow sensor includes a measuring element. The measuring element includes: a semiconductor substrate; a heating resistor and a temperature measuring resistor both formed as a result of thin films being stacked over the semiconductor substrate; an electronic insulator including a silicon oxide film; and a diaphragm portion formed after part of the semiconductor substrate is removed. The heating resistor and the temperature measuring resistor are formed over the diaphragm portion. In the thermal air flow sensor, a ratio of an area occupied by the thin films to an area of the measuring element ranges between 40% and 60%.


Find Patent Forward Citations

Loading…