logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9718994 B1

PDFFull Text
Date of Patent:
Aug. 01, 2017

Filed:

Dec. 04, 2014

Conductive adhesive tape and manufacturing method thereof

Applicant:

Amogreentech Co., Ltd., Gimpo-si, KR;

Inventors:

Seung Hoon Lee, Goyang-si, KR;

Yong Sik Jung, Namyangju-si, KR;

Yun Mi So, Daejeon, KR;

Assignee:

AMOGREENTECH CO., LTD., Gimpo-si, KR;

Attorney:

Cantor ColburnLLP

Primary Examiner:

Victor Chang

Int. Cl.
CPC ...
C09J 7/02 (2006.01); C09J 9/02 (2006.01); C09J 7/04 (2006.01); B32B 37/15 (2006.01); H01B 1/00 (2006.01); H01B 13/32 (2006.01); B32B 5/26 (2006.01); B32B 7/12 (2006.01); C08K 3/04 (2006.01);
U.S. Cl.
CPC ...
C09J 7/0289 (2013.01); B32B 5/26 (2013.01); B32B 7/12 (2013.01); B32B 37/15 (2013.01); C09J 7/02 (2013.01); C09J 7/0296 (2013.01); C09J 7/041 (2013.01); C09J 9/02 (2013.01); H01B 1/00 (2013.01); H01B 13/32 (2013.01); B32B 2250/02 (2013.01); B32B 2405/00 (2013.01); C08K 3/04 (2013.01); C08K 2201/001 (2013.01); C09J 2201/134 (2013.01); C09J 2201/602 (2013.01); C09J 2205/102 (2013.01); C09J 2400/163 (2013.01); C09J 2400/263 (2013.01); C09J 2467/006 (2013.01); Y10T 428/1476 (2015.01); Y10T 428/249983 (2015.04);
Abstract

Provided is a conductive adhesive tape comprising: a substrate that is formed in a nano-web form having a number of pores by spinning a polymer material by a spinning method; and a conductive adhesive layer that is formed in a non-porous form by directly spinning a conductive adhesive material by a spinning method on one or both surfaces of the substrate, or that is laminated on one or both surfaces of the substrate. Accordingly, thickness of the adhesive tape can be made thin, adhesive strength of the adhesive tape can be enhanced, and the adhesive tape can be precisely attached on even a curved surface. Further, when removing the adhesive tape from components, the adhesive layer can be prevented from remaining on the surface of the components.

Find Patent Forward Citations

Loading…