The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2017

Filed:

Jun. 12, 2015
Applicant:

Invensense, Inc., San Jose, CA (US);

Inventors:

Daesung Lee, Palo Alto, CA (US);

Jongwoo Shin, Pleasanton, CA (US);

Jong Il Shin, San Jose, CA (US);

Peter Smeys, San Jose, CA (US);

Assignee:

INVENSENSE, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); B81C 1/00 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00301 (2013.01); H01L 21/76877 (2013.01); H01L 21/76898 (2013.01); H01L 23/5226 (2013.01); B81C 2201/013 (2013.01); B81C 2203/036 (2013.01);
Abstract

A method for forming a MEMS device is disclosed. The MEMS device includes a MEMS substrate and a base substrate. The MEMS substrate, where includes a handle layer, a device layer and an insulating layer in between. The method includes the sequential steps of: providing a standoff on the device layer; etching a via through the device layer and the insulating layer; providing a contact layer within the via, wherein the contact layer provides electrical connection between the device layer and the handle layer; providing a bonding layer on the standoff; and bonding the bonding layer to pads on the base substrate.


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