The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2017
Filed:
Nov. 12, 2014
Sonoco Development, Inc., Hartsville, SC (US);
Hugo Giorgio, Franklin, IN (US);
Eugene T. Smith, Charlotte, NC (US);
Joseph Donald Gagne, Holyoke, MA (US);
Jacob Donald Prue Branyon, Hartsville, SC (US);
Sonoco Development, Inc., Hartsville, SC (US);
Abstract
A reclosable package is described that includes a package integrity feature defined by an inner film layer of the package. The package integrity feature includes a first die cut portion and a second die cut portion that both extend from a main die cut portion at least partially defining the opening of the package. The first and second die cut portions are continuous with each other and with the main die cut portion, such that they are defined by a single cut line. In some cases, the package integrity feature includes a neck region that tears when the package is opened and an anchor region that resists delamination. Because the first and second die cut portions are continuously formed with each other, the anchor region may have a circular or elliptical shape and is, thus, easier and more consistently manufactured, allowing for better performance.