The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2017

Filed:

Sep. 14, 2012
Applicants:

Paul Franklin Nealey, Madison, WI (US);

Huiman Kang, Madison, WI (US);

Guoliang Liu, Madison, WI (US);

Hiroshi Yoshida, Mito, JP;

Yashuhiko Tada, Hitachinaka, JP;

Juan Jose DE Pablo, Madison, WI (US);

Abelardo Ramirez-hernandez, Madison, WI (US);

Inventors:

Paul Franklin Nealey, Madison, WI (US);

Huiman Kang, Madison, WI (US);

Guoliang Liu, Madison, WI (US);

Hiroshi Yoshida, Mito, JP;

Yashuhiko Tada, Hitachinaka, JP;

Juan Jose De Pablo, Madison, WI (US);

Abelardo Ramirez-Hernandez, Madison, WI (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/10 (2006.01); B32B 37/14 (2006.01); B82Y 30/00 (2011.01); B81C 1/00 (2006.01); H01L 21/033 (2006.01);
U.S. Cl.
CPC ...
B32B 3/10 (2013.01); B32B 37/14 (2013.01); B81C 1/00031 (2013.01); B82Y 30/00 (2013.01); H01L 21/0337 (2013.01); B81C 2201/0149 (2013.01); Y10T 428/24851 (2015.01);
Abstract

Provided are methods of fabricating thin film structures that involve assembling block copolymer materials in the presence of condensed phase surfaces on both sides of the thin film, at least one of which is a chemically patterned surface configured to direct the assembly of the block copolymer material. According to various embodiments, the other of the condensed phase surfaces can be a chemically homogenous surface or a chemically patterned surface. Also provided are structures, morphologies, and templates formed in the domain structure of block copolymer materials. In certain embodiments, complex 3-D morphologies and related structures not present in bulk block copolymer materials are provided.


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