The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 01, 2017

Filed:

Oct. 28, 2014
Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Kunihiko Yoshioka, Nagoya, JP;

Kimihisa Kaneko, Nagoya, JP;

Makoto Ohmori, Ohbu, JP;

Kenji Suzuki, Nagoya, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 39/02 (2006.01); B28B 1/00 (2006.01); B29C 39/12 (2006.01); B28B 1/24 (2006.01); B28B 7/00 (2006.01); B28B 19/00 (2006.01); C04B 37/00 (2006.01);
U.S. Cl.
CPC ...
B28B 1/008 (2013.01); B28B 1/24 (2013.01); B28B 7/0091 (2013.01); B28B 19/0015 (2013.01); B29C 39/021 (2013.01); B29C 39/023 (2013.01); B29C 39/12 (2013.01); B29C 39/123 (2013.01); C04B 37/001 (2013.01); C04B 2235/602 (2013.01); C04B 2235/6023 (2013.01); C04B 2237/68 (2013.01); C04B 2237/78 (2013.01); Y10T 428/24355 (2015.01); Y10T 428/24413 (2015.01); Y10T 428/24612 (2015.01); Y10T 428/24628 (2015.01); Y10T 428/31504 (2015.04);
Abstract

A second mold is placed on a planar surface of a first mold to form a first mold cavity, which is filled with a first material slurry containing a first material powder and the molded slurry is caused to set, thereby forming a first molded part on the planar surface of the first mold. A third mold is placed on the planar surface of the first mold from which the second mold is removed and on which the first molded part is formed, thereby forming a second mold cavity. The second mold cavity is filled with a second material slurry which contains a second material powder different from the first material powder so as to mold the slurry in contact with the first molded part. The molded slurry is caused to set, thereby forming a second molded part on the planar surface of the first mold.


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