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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9717163 B1

PDFFull Text
Date of Patent:
Jul. 25, 2017

Filed:

Mar. 26, 2014

Electronic component mounting structure, manufacturing method and electronic component product

Applicant:

Innogration (Suzhou) Co., Ltd, Jiangsu, CN;

Inventors:

Chu Ming Shih, Phoenix, AZ (US);

Gordon C. Ma, Suzhou, CN;

Assignee:

INNOGRATION (SUZHOU) CO., LTD., Jiangsu, CN;

Attorneys:

Honigman Miller Schwartz and Cohn LLP

Matthew H. Szalach

Jonathan P. O'Brien

Primary Examiner:

Anthony Haughton

Assistant Examiner:

Razmeen Gafur

Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); H01L 23/367 (2006.01); H05K 3/00 (2006.01); H05K 3/30 (2006.01); H05K 7/02 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20509 (2013.01); H01L 23/3677 (2013.01); H05K 1/0204 (2013.01); H05K 3/0044 (2013.01); H05K 3/301 (2013.01); H05K 7/02 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/19107 (2013.01); H05K 2201/0347 (2013.01); H05K 2201/10416 (2013.01); H05K 2203/1461 (2013.01);
Abstract

An electronic component mounting structure, manufacturing method and an electronic component product are provided. The electronic component mounting structure comprises a printed circuit board, a metal flange, and a plurality of electronic components provided on the metal flange; a groove is provided on the printed circuit board, a metal layer is coated on a wall of the groove, the metal flange is restricted to the metal layer on the wall and is fixed in the groove, the one or more electronic components are connected to each other through a plurality of wires based on a circuit requirement, an input electrode and an output electrode are provided on the printed circuit board in a portion adjacent to the metal flange, and the input electrode and the output electrode are connected to the one or more electronic components mounted on the metal flange through wires respectively.

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Shih, Chu. (2017). Electronic component mounting structure, manufacturing method and electronic component product (U.S. Patent No. 9717163). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9717163

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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