The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 25, 2017

Filed:

Jan. 10, 2014
Applicants:

Tomas Rodinger, Vancouver, CA;

Gimmy Chu, Mississauga, CA;

Christian Yan, Scarborough, CA;

Inventors:

Tomas Rodinger, Vancouver, CA;

Gimmy Chu, Mississauga, CA;

Christian Yan, Scarborough, CA;

Assignee:

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05B 33/08 (2006.01); F21V 29/00 (2015.01); H05K 1/02 (2006.01); F21K 9/232 (2016.01); F21Y 101/00 (2016.01); F21Y 115/10 (2016.01); F21Y 107/40 (2016.01);
U.S. Cl.
CPC ...
H05B 33/0806 (2013.01); F21K 9/232 (2016.08); F21V 29/004 (2013.01); H05B 33/0803 (2013.01); H05B 33/0815 (2013.01); H05K 1/0278 (2013.01); F21Y 2101/00 (2013.01); F21Y 2107/40 (2016.08); F21Y 2115/10 (2016.08); H01L 2924/0002 (2013.01); H05K 2201/047 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/10106 (2013.01); H05K 2203/0228 (2013.01); Y02B 20/348 (2013.01);
Abstract

An LED bulb comprises a structural shell formed by folding a flat PCB into a three-dimensional polyhedron shape and a fitting for removably coupling the bulb to a light socket. The PCB comprises a plurality of LEDs, at least one LED mounted electronically on a plurality of faces of the polyhedron, and a driver circuit for driving each LED. The perimeter of the PCB is shaped to join adjacent faces. Each LED produces minimal excess heat, which is partially conducted by a metallic heat sink bridge to the PCB and dissipated to the air through the PCB and through a plurality of spaces in the shell.


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